{"L1_core": {"domain": "electronics", "category": "pcb_assembly", "entity_type": "process"}, "L2_process": {"types": {"reflow": {"description": "Solder reflow in oven"}, "paste_printing": {"description": "Solder paste deposition"}, "pick_and_place": {"description": "Component placement"}}, "standards": ["IPC-A-610", "IPC J-STD-001", "IPC-7711/7721"], "parameters": {"reflow_temp_C": [220, 260], "throughput_cph": [1000, 100000], "component_size_min_mm": 0.2, "placement_accuracy_um": [25, 50]}}, "L5_metadata": {"updated": "2026-01-04", "version": "2.0"}, "L3_relations": {"applies_to": ["pcb", "flex_pcb", "rigid_flex"], "related_processes": ["tht_assembly", "aoi_inspection", "wave_soldering"]}}