{"L1_core": {"domain": "electronics", "category": "soldering", "entity_type": "process"}, "L2_process": {"types": {"hand_soldering": {"description": "Manual iron soldering"}, "wave_soldering": {"description": "Automated wave process"}, "selective_soldering": {"description": "Robotic selective process"}}, "standards": ["IPC J-STD-001", "IPC-A-610", "EN 60068-2-58"], "parameters": {"flux_type": ["rosin", "water_soluble", "no_clean"], "tip_temp_C": [315, 400], "solder_alloy": ["Sn63Pb37", "SAC305", "Sn99.3Cu0.7"]}}, "L5_metadata": {"updated": "2026-01-04", "version": "2.0"}, "L3_relations": {"applies_to": ["pcb", "wires", "terminals", "connectors"], "related_processes": ["smt_assembly", "tht_assembly", "rework"]}}